M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Good wettability with low Ag alloy can help to reduce material cost.
●Wettability test for through hole pad
Select flux base material according to higher melting point of solder alloy.Less spattering can achieve high performance soldering.
●Spattering test with soldering robot
Reduce flux spattering Collect spattered flux onto thermal paper. 【Condition】 |  |
Good solderbility can achieve higher productivity for various type parts
●Comparison of solder bridge with line soldering
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7) |
|---|---|
| Flux type | JIS-A MIL-RMA |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.08％～0.14％ |
| Copper plate corrosion test | No Corrosion |
| Copper mirror corrosion | No Corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No Migration |
| Flux name | MFJ |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.
Products