Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Corporate history

1918Minoru Ishikawa is engaged in the manufacture of solder and white metal, and serve on the acquisition of technology.
1935Ishikawa metal Industries inc. is founded as the individual companies.
1946After the war, buiness is resumed at Naniwa-ku, Osaka-shi Ebisu-cho.
1952Ishikawa metal Industries Co.Ltd is reorganized to Corporation, depending on the progress of the business.
1955Awarded license of JIS indication by Ministry of International Trade and Industry about white metal.
1959Awarded license of JIS indication by Ministry of International Trade and Industry about solder..
1967Awarded license of JIS indication by Ministry of International Trade and Industry about flux cored solder. wire.
1976Toru Ishikawa was Appointed as CEO
1978Participated in the Sakai machinery Kinzokudanchi cooperatives relocated to the current location.
for the sake of Pollution elimination and productivity improvement. renamed to Ishikawa Metal Co..
1980Awarded license of The MIL standard certification by the Defense Agency.
1983Developed the “Super Rosin GX”.for spattering preventing solder for precision electronic parts corresponding to the needs of the industry due to the deployment of advanced technology field.
1984Developed the “Stechron” solder containing an active agent corresponding to the diversification of the base material.
1985Developed the solder paste “Soldim” corresponding to the needs of surface mount technology which is evolving.
1987Developed the “Super Rosin GXM and GXR” less flux spattaring and solder ball type based on Super Rosin GX technology.
1988Developed the “Soldim color” corresponding to the automatic recognition of the solder paste printing in SMT.
1991Developed RMA solder paste for Nitrogen furnace and air reflow furnace and also for chip standing preventing.
1992Developed flux cored solder wire TT53 with ultra-low scattering properties. Development patent application of solder with resistance for heat shock.
1993US patented the solder paste corresponding light beam heating.
1995Get the US national standard of the flux cored solder wire “Super Rosin GXM” and “Stechron RA” and the solder paste “Soldim 878” (ANSI / J-STD). Development patent application of flux cored solder wire “Taflock” Scattering of flux, and the residue of crack, solder enters heat which prevent flux spattering, the residue of crack, and heat lean.
1996Development patent application of Lead-free solder.
1999ISO9001 certification.
2000Development patent application of “Alumax” for aluminum coil soldering.
2002KIX Techno Center completed
Established China Wuxi factory
2003ISO14001 certification.
Patent application Copper erosion preventing lead-free solder.
Patent application low spattaring ree solder High workability, solder “SPM” patent application Cored low scattering lead-free.
2007Patent application “E series” chip erosion prevent type flux cored solder wire.
2008Patent application “8900” active-controlled lead-free solder paste.
2010Representative Director in Hiroshi Ishikawa appointed.
2011Jointly developed with Denso, high reliability lead-free flux cored solder wire “DDL”, “DDH” residue crack prevention type,also patent application.