Management System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Home > Lead-free (EVASOL) > [Solder paste (bottle)] Printing type for LASER 8229 series
Suitable for LASER heat soldering.Achieve good soldering quality, despite the rapid heating.
●Thermal shock test(QFP shoot in transmitted light)
Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip
Irrdiation method:Radiate the entire chip and pad
Enable to adopt into general use printer for SMT.No special printer is required
●Viscosity test of cotinuous printing
Stable viscosity of continuous printing
Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.
●LASER SMT test of QFP parts
Enables combine to printing, suitable for various SMT parts
Irradiation:5 sec/25pins
Parts:0.5mm pich QFP
Irradiation method:Scan irradiation to leads and pads
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
---|---|
Flux type | MIL-RMA |
Halide contents | 0.10%~0.14% |
Powder particle size(μm) | 38~20(Type 4) |
Flux contents(%) | 10.5% |
Deterioration(Pa・S) | 230 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 5.0×108Ω |
Electrochemical migration | No migration |
Flux name | 8229 |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.