Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Flux cored solder wire

Water soluble type WSG series

Good wettability

Apply flux activator according to base material.Good solderbility can achieve higher productivity for various type parts.

Good wettability

●Wettability comparison in line soldering

Sustained wettability


Iron temp:360℃

Iron speed:5mm/s

Good water washability

Water soluble base material instead of rosin.The residue after soldering is possible to clean away easily with water.

Good water washability

●Ionic residue test

The flux residue is possible to clean with water

  • 【Test method】JIS Z 3197 8.5.2

    Cleaning solution:Pure water
    Washing temp:50℃
    Washing time:1 min
    Number of washings:3

Reduce spattering

With the effect of special activator, solder and flux spattering were reduced.Higher mounting quality can be secured.

Very few spattering

●Flux spattering test with soldering iron robot

Few spattering

Collect spattered flux onto thermal paper.

Iron temp:380℃
Feed speed:15mm/s
Feed length:5mm × 200 shots

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
J9 (Sn:Bal / Ag 3.5 / Cu 0.7)
Flux type Water soluble type
Flux contents (%) 2.0%、3.0%
Halide contents 1.6%~2.4%
Copper plate corrosion test No corrosion
(after cleaning with water)
Copper mirror corrosion No corrosion
(after cleaning with water)
Insulation resistance(Ω) More than 1.0×108Ω
(after cleaning with water)
Electrochemical migration No migration
(after cleaning with water)
Flux name WSG