Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Flux cored solder wire

Good wettability type MFJ series

Support low Ag alloy

Good wettability with low Ag alloy can help to reduce material cost.

Good wettability for both of 3% Ag and low Ag

●Wettability test for through hole pad

Reduce flux spattering

Select flux base material according to higher melting point of solder alloy.Less spattering can achieve high performance soldering.

Less spattering

●Spattering test with soldering robot

Reduce flux spattering

Collect spattered flux onto thermal paper.

Iron temp:380℃
Feed speed:15mm/s
Feed length:5mm×200 shots

Good durability of wettability

Good solderbility can achieve higher productivity for various type parts

Good durability of wettability

●Comparison of solder bridge with line soldering

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
R8 (Sn:Bal / Cu 0.7)
Flux type JIS-A
Flux contents (%) 3.0%、4.0%、6.0%
Halide contents 0.08%~0.14%
Copper plate corrosion test No Corrosion
Copper mirror corrosion No Corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No Migration
Flux name MFJ