Select suitable flux base material for higher melting point alloy.Very few flux spattering can achieve high performance soldering.
●Flux spattering test by using soldering iron robot
Solderable to aluminum
Put solder wire on aluminum board and heat by 270℃
Selected materials suitable for rapid light heating achieves high workability. Good wettability with low Ag alloy can help to reduce cost.
●Confirmation of wettability with LASER soldering
Beam power:40W Wire diameter:φ0.8mm
Preheat:0.05 Wire feed:7mm/s,1.6s
Postheating:0.3s PCB:Cu,one side
Connector terminal:Brass,Sn plating on Ni
Good for after soldering appearance with transparent flux such as LED illumination.Can achiece higher productivity for outlook inspection.
●Put solder on white ceramic plate and heat with 270℃
Can achieve higher productivity for outlook inspection
|Alloy type||J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
R8 (Sn:Bal / Cu 0.7)
|Flux contents (%)||3.0％、4.0％、6.0％|
|Copper plate corrosion test||No corrosion|
|Copper mirror corrosion||No corrosion|
|Insulation resistance（Ω）||More than 5.0×108Ω|
|Electrochemical migration||No migration|