Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Flux cored solder wire

Non-cleaning type for stainless steel,nickel,brass ESK series

Solderable to stainless steel

Suppress the corrosion to secure the reliability after solderig.Cleaning of flux residue is not required like the general flux cored solder wire.

Solderable to stainless steel

●Wettability test for stainless steel plate

Good solderability also in stainless steel
Iron temp:380℃
Base material:SUS304

Strong wettability

Use a fluorine-based special activater. Strong activation force produces good workability for flame base material such as nickel and brass.

Good workability for flame base material

●Wettability test for Ni pad

Good wettability enabls to shorten working time.
Iron temp:370℃
Soldering time:2.5s/point


Apply water-soluble base material instead of rosin.The residue after soldering is possible to wash away easily with water.


●Copper plate corrosion test

Strong activity and low corrosivity stand side by side

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type Fluorine type
Flux contents (%) 3.0%、4.0%、6.0%
Halide contents 0.1%~0.4%
Copper plate corrosion test No corrosion
Insulation resistance(Ω) More than 1.0×107Ω
Electrochemical migration No migration
Fluorine contents(%) 0.2%~0.4%
Flux name ESK