Suppress the corrosion to secure the reliability after solderig.Cleaning of flux residue is not required like the general flux cored solder wire.
●Wettability test for stainless steel plate
Good solderability also in stainless steel
Use a fluorine-based special activater. Strong activation force produces good workability for flame base material such as nickel and brass.
●Wettability test for Ni pad
Good wettability enabls to shorten working time.
Apply water-soluble base material instead of rosin.The residue after soldering is possible to wash away easily with water.
●Copper plate corrosion test
Strong activity and low corrosivity stand side by side
|Alloy type||J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
|Flux type||Fluorine type|
|Flux contents (%)||3.0％、4.0％、6.0％|
|Copper plate corrosion test||No corrosion|
|Insulation resistance（Ω）||More than 1.0×107Ω|
|Electrochemical migration||No migration|