M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Special activators achieve the same wettability as regular non-crean solder paste.
●Confirm wettability during continuous printing
Good wettability continues even during long-term continuous printing
0.5mm QFP
Stencil thickness:0.15mm
Use material that is highly miscible with solvents for the flux base.Improves the washability of the residue.
●Ionic residue test
After 1 min washing with IPA at 40℃, measure the amount of ions
Good washability in the ionic residue test
Prevents the reaction of the flux and powder, in order to prevent the viscosity increasement during continuous printing.Enable to implement stably.
●Confimation of the shape of the printed solder paste
Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | Less than 0.007% |
| Powder particle size（μm） | 38～25(Equivalent to type4) |
| Flux contents（％） | 11.0% |
| Deterioration（Pa・S） | 220 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 8820 |
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