Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Halogen free less spattering type 8850 series

Good wettability, applicable to low-Ag solder

The special activater enables to use low-Ag alloy.Achieves both of halogen-free and cost reduction.

Good wettability for both of 3% Ag and low Ag

●High temperature preheating test

Low Ag alloy has euivalent wettability to 3Ag
0.5mm pitch

Reduce the chip side balls

Easily applicable to low Ag for the improved heat resistance of the flux.It may help to reduce the cost.

Reduce the chip side balls

●Chip side ball test after reflow(3216 chip)

Reduce the chip side ball, ensure the good SMT quality

Reduce flux spattering

Selecting proper activator achieved less flux spattering during reflow soldering

Less flux spattering

●Spattering test with reflow

Stable shape after long time printing
0.4mm pitch QFP
Stencil thickness:0.12mm

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type Halogen free
Halide contents Less than 0.02%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 11.5%
Deterioration(Pa・S) 190
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Halogen contents(ppm) Cl : Less than 900
Br : Less than 900
Flux name 8850