M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Suitable for LASER heat soldering.Achieve a good soldering quality, with avoiding satelite balls.
●Solder ball test by LASER heating
Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip
No intentional addition of chlorine(Cl) and bromine(Br), which genelate dioxins.Compliant with most of halogen-free standards.
●Compliant situation of 8239 series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non Compliant |
Comply to all of halogen free standards
Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.
●Viscosity test of continuous printing
Stable viscosity of continuous printing
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0.10%～0.14% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 10.5% |
| Deterioration（Pa・S） | 230 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migraiton |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 8239 |
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