Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Halogen free wash type 8825 series

Correspond to the washing process

Use a material that is highly miscible with solvents for the flux base.Improves the washability of the residue.

Good washability

●Ionic residue test

After 1 min washing with IPA at 40℃, measure the amount oof ions.
Good washability in the ionic residue test

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 8825 series

StandardsCompliant situation
JEITA ET-7304ANon Compliant

Comply to all of halogen free standards

Long lasting printing stability

Prevents the reaction of the flux and powder,in order to prevent the viscosity increasement during continuous printing.Enable to implement stability.

Compliant for low temperature reflow

●Confirmation of the shape of the printed solder paste

Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm

Alloy typeJ3 (Sn:bal / Ag 3.0 / Cu 0.5)
Flux typeHalogen free
Halide contentsLess than 0.01%
Powder particle size(μm)38~25(Equivalent to type 4)
Flux contents(%)11.0%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 5.0×108Ω
Electrochemical migrationNo migration
Halogen contents(ppm)Cl : Less than 900
Br : Less than 900
Flux name8825