Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

High reliability type for automotive 1500 series

Prevent crack of residue

Elasticity of flux residue of applying special resin prevents crack of residue after soldering and helps to improve surface insulation resistance greatly

Prevent crack residue

●Thermal shock test(QFP shoot in transmitted light)

-40℃ to 80℃ 30min 168 Cycles,
0.5mm pitch QFP

Good wettability

Select suitable activators for synthetic resin and the wettability is almost same as conventional solder paste

Good wettability

●Test by reflow soldering

Pre heat:150~200℃ 120 seconds
Main heat:240~245℃, 45 seconds

High electric reliability

Select suitable base resin and activators in order to get high surface insulation resistance.

High electric reliability

●Surface insulation resistance test

Achieve a high insulation resistance value than regular products
Test board:JIS-II

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type JIS-AA
Halide contents Less than 0.02%
Powder particle size(μm) 38~20(Type 4)
Flux contents(%) 12.0%
Deterioration(Pa・S) 210
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 1.0×109Ω
Electrochemical migration No migration
Flux name 1500