Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Less void halogen free standard compliant type 7510 series

Reduce void

Adding material which faciliated that the gas in the molten solder comes out, it may reduce the remaining of voids.

Reduce void

●Comparison of voids after continuous printing

Stable void reduction

Halogen-free compliant

No intentional addition of chlorine(Cl) bromine(Br), which generate dioxins.Compliant with most of halogen-free standards

Halogen-free compliant

●Compliant situation of 7510 series

StandardsCompliant situation
JEITA ET-7304ANon Compliant

Comply to all of halogen free standards

Advanced wettability

Higher heat resistance can reduce defect of non-wetting and non-melting

Good wettability

●Confirmation of wettability by reflow

Less void in large parts
Pre heat:180℃,120 seconds
Component:6mm■ parts

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux typeHalogen free
Halide contentsLess than 0.01%
Powder particle size(μm)38~20(Type 4)
Flux contents(%)11.5%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 1.0×108Ω
Electrochemical migrationNo migration
Halogen contents(ppm)Cl : Less than 50
Br : Less than 100
Flux name7510