Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Low melting point halogen free standard compliant type 7610 series

Applied with low melting point alloy

Special designed for SMT of heat-sensitive parts.Solution for non-heat resistant parts soldering.

Good wettability

●Good wettability at low temperature heating

Component:1005 chip
Profile:See the right graph

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which genelate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 7610 series

StandardsCompliant situation
JEITA ET-7304ANon Compliant

Comply to all of halogen free standards

Applicable for low temperature reflow

Good wettability at even 160℃.Prevents joint failure and enhances reliability.

Compliant for low temperature reflow

●Reflow profile example

Sufficient wettability at a peak temperature of 160℃

Alloy typeF7 (Sn:Bal / Bi 58)
Flux typeHalogen free
Halide contentsLess than 0.01%
Powder particle size(μm)45~25(Type 3)
Flux contents(%)9.5%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 1.0×108Ω
Electrochemical migrationNo migration
Halogen contents(ppm)Cl : Less than 50
Br : Less than 100
Flux name7610