Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Low residue type 6001 series

Applicable for ICT testing

Reduce failure ratio of ICT test.Select special base material to reduce flux residue after soldering.

Very low failure ratio on ICT

●Residue penetrate force test

Penetrating force is lower than regular product
Reflow with N2(O2 ratio 1000ppm) and measure penetrating force of checker pin with 10mm/sec speed until get contact

Good wettability

Apply special activator and achieved to get good wettability although the flux residue is lesser than regular solder paste

Good wettability

●Continuous wettability test

Reflow with N2
O2 ratio 1000ppm
0.5mm pitch QFP
Stencil thickness 0.15mm

Stable printing quality

Prevent reaction between flux and solder powder and stabilize printing quality during long time continuous printing of paste.

Good stability on continuous printing

●Shape of printed solder paste

Stable shape after long time printing
0.3mm QFP
Stencil thickness:0.12mm

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type MIL-RMA
Halide contents 0.01%~0.05%
Powder particle size(μm) 45~25(Type 3)
Flux contents(%) 10.5%
Deterioration(Pa・S) 195
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Flux name 6001