Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Printing type for LASER 8229 series

Suitable for LASER soldering

Suitable for LASER heat soldering.Achieve good soldering quality, despite the rapid heating.

●Solder ball test by LASER heating

●Thermal shock test(QFP shoot in transmitted light)

Few solder ball occurs by rapid heating in short time
Irradiation time:0.2 sec
Parts:1005R chip
Irrdiation method:Radiate the entire chip and pad


Enable to adopt into general use printer for SMT.No special printer is required

Stable viscosity

●Viscosity test of cotinuous printing

Stable viscosity of continuous printing

Brand-new process

Enable to adopt brand-new process combined LASER and printer which can shorten the SMT processing time as reflow oven is not required.

Suitable for LASER heating of SMT package

●LASER SMT test of QFP parts

Enables combine to printing, suitable for various SMT parts
Irradiation:5 sec/25pins
Parts:0.5mm pich QFP
Irradiation method:Scan irradiation to leads and pads

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux typeMIL-RMA
Halide contents0.10%~0.14%
Powder particle size(μm)38~20(Type 4)
Flux contents(%)10.5%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 5.0×108Ω
Electrochemical migrationNo migration
Flux name8229