Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Transparent residue for LED soldering type 8860 series

No color flux residue

Apply colorless base material suppress the coloring of the residue.Beautiful soldering appearance persists without discoloration long time after SMT.

No color flux residue achieve good appearance

●Comparison of residues after reflow

Ensure high quality soldering in illumination equipment such as LEC lamps

High insulation resistance at high temperatures

Optimization of the type and amount of activator keep the insulative even at high temperatures.Malfunction of the LED lighting equipment is prevented under harsh environment.

High insulative even at high temperature

●Insulation resistance test at 85℃ and 120℃

Stable insulation resistance
Test voltage:100V

Applicable for Low Ag alloy

Corresponds to the low-Ag alloy, and already it has been approved by several users.Low-Ag alloy helps reducing material cost.

Applicable for Low Ag alloy

●Wetting result with Low Ag(Sn-0.3Ag-0.7Cu)alloy

Good wettability for low Ag
Pre heating:150℃~170℃,100 sec
Heating:230~255℃,60 sec

Alloy type J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux type MIL-RMA
Halide contents Less than 0.03%
Powder particle size(μm) 38~25(Equivalent to type4)
Flux contents(%) 11.7%
Deterioration(Pa・S) 200
Copper plate corrosion test No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) More than 5.0×108Ω
Electrochemical migration No migration
Flux name 8860