M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.
●Comparison of solder ball
No solder ball by rapid heating
1608R chip
Beam power:30W
No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.
●Compliant situation of 3700 series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Compliant |
Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.
●Continuous dispense test
Suitable for various SMT parts
| Alloy type | F12 (Sn:Bal / Bi 57.0 / Ag 1.0) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0.16％～0.24％ |
| Powder particle size（μm） | 20～10(Equivalent to type 5) |
| Flux contents（％） | 13.0% |
| Deterioration（Pa・S） | 110 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 2300 |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.
Products