Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (syringe)

Completely halogen free type 3700 series

Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Good washability

●Comparison of solder ball

No solder ball by rapid heating
1608R chip
Beam power:30W

Completely halogen-free

No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.

Halogen-free compliant

●Compliant situation of 3700 series

Standards Compliant situation
JPCA-ES01 Compliant
IEC61249-2-21 Compliant
IPC4101B Compliant
JEITA ET-7304A Compliant
Comply to all of halogen free standards

Good dispensing stability

Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.

Good dispensing stability

●Continuous dispense test

Suitable for various SMT parts

Alloy typeF12 (Sn:Bal / Bi 57.0 / Ag 1.0)
Flux typeHalogen free
Halide contents0.16%~0.24%
Powder particle size(μm)20~10(Equivalent to type 5)
Flux contents(%)13.0%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 1.0×108Ω
Electrochemical migrationNo migration
Halogen contents(ppm)Cl : Less than 50
Br : Less than 100
Flux name2300