Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (syringe)

For micro components 3230 series

Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608 chip
LASER power:40W

Specialize in the SMT of micro-components.

Special designed for the soldering of micro-components, Solution for peculiar problems of micro components.

Special designed for micro-components

EVASOL 3230 series is special designed for micro-components.Please use the 3229 series for large parts.

●Applicable example
Smaller chip components than 1608
Camera module of smartphone etc.

●Inapplicable example
Through-hole parts, connectors

Good dispensing stability

Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.

Good dispensing stability

●Continuous dispense test

Stable dispense volume

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux typeMIL-RMA
Halide contents0.08%~0.1%
Powder particle size(μm)38~20(Type 4)
Flux contents(%)14.5%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 1.0×108Ω
Electrochemical migrationNo migration
Flux name3230