Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (syringe)

For SMT・connecter 3229 series

Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
1608 chip
LASER power:8W

Suitable for large component

Enables SMT of complicated PCB for various parts large and small from the chip to the connector.

Suitable for large component

●Comparison of solder ball of connector parts

Prevention of solder ball for large component
2.5mm pitch connector
Beam power:40W

Already approved in automotive field

Approved by SMT of automotive electrical components more than 10 years.Suitable for higher requirement about SMT quality and reliability.

Reducing slumps in rapid heating

●Confirmation the shape with LASER heating

No slumps in heat, Preventing”Bridge”for large component.
2.5mm pitch connector
Beam power:40W

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux typeMIL-RMA
Halide contents0.08%~0.1%
Powder particle size(μm)45~25(Type 3)
38~20(Type 4)
Flux contents(%)14.0%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 5.0×108Ω
Electrochemical migrationNo migration
Flux name3229