Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (syringe)

Halogen free for micro components 3232 series

Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Good washability

●Comparison of solder ball

No solder ball by rapid heating
1608R chip
Beam power:40W

Completely halogen-free

No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.

Halogen-free compliant

●Compliant situation of 3232 series

StandardsCompliant situation
JEITA ET-7304ANon Compliant

Comply to all of halogen free standards

Specialize in the micro-parts soldering

Special designed for the soldering of micro-components,Solution for peculiar problems of micro-components.

Suitable for LASER heating of narrow pitch

●SMT test of QFP parts

Suitable for various SMT parts

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux typeHalogen free
Halide contents0.10%~0.14%
Powder particle size(μm)25~15(Type 5)
Flux contents(%)14.5%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)1.0×108Ω
Electrochemical migrationNo migration
Halogen contents(ppm)Cl : Less than 50
Br : Less than 100
Flux name3232