Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (syringe)

Halogen free low melting point 2300 series

Reduce solder ball

Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.

Reduce solder ball

●Comparison of solder ball

No solder ball by rapid heating
0.4mm pitch QFP
Beam power:40W

Halogen-free compliant

No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.

Halogen-free compliant

●Compliant situation of 2300 series

StandardsCompliant situation
JEITA ET-7304ANon Compliant

Comply to all of halogen free standards

Applied with low melting point alloy

Special designed for SMT of heat-sensitive parts.Solution for weak-heat resistant parts soldering.

Various applications


No slumps in heat, Preventing”Bridge”for large component.
2.5mm pitch connector
Beam power:40W

Alloy typeJ3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)
Flux typeMIL-RMA
Halide contents0.08%~0.1%
Powder particle size(μm)45~25(Type 3)
38~20(Type 4)
Flux contents(%)14.0%
Copper plate corrosion testNo corrosion
Copper mirror corrosionNo corrosion
Insulation resistance(Ω)More than 5.0×108Ω
Electrochemical migrationNo migration
Flux name3229