Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com

Flux cored solder wire

Others

TAFLOCK series

Residue crack preventing type

Item name Alloy type Halide contents (%) Characteristics application Diameter
TAFLOCK M3 Sn-40Pb 0.12 High reliability Applicable in sevior high temp. environment like automotive components or for flexible PCB for precision products. Can be used by LASER soldering. 1.6, 1.2, 1.0, 0.8, 0.6
TAFLOCK E3 Cl:0.2 F:0.2 Strong activity

HAI series

High Melting Point Solder

Item name Alloy type Melting point(℃) Diameter
Solidus temperature Liquidus temperature
HAI-221 Sn96.5-Ag3.5 221 1.6, 1.2, 1.0, 0.8
HAI-240 Sn95-Sb5 235 240
HAI-280 Sn5-Pb92.5-Ag2.5 296 300
HAI-309 Sn1.3-Pb97.2-Ag1.5 309

SUPAX

Excellent wettability for all of material except aluminum.
Item name Alloy type Characteristics Diameter
SUPAX Sn40-Pb60 Need to wash out the flux residue by water 1.6

G series

Prevent Ag corrosion

Item name Alloy type Melting point(℃) Diameter
Solidus temperature Liquidus temperature
G2062GXB3 Sn62-Pb36-Ag2 179 190 1.6, 1.2, 1.0, 0.8
G3060GXB3 Sn60-Pb37-Ag3 179 221

FAI

Low melting point alloy solder wire

Item name Alloy type Characteristics Diameter
FAI-165MB Sn43-Pb43-Bi14 Melting point 135-165℃ with excellent wettability flux cored 1.6, 1.2, 1.0, 0.8, 0.6

ALUMAX

Flux cored solder wire for aluminum

Item name Alloy type Characteristics
ALUMAX Sn45-Ag1-Sb0.5-Pb53.5 Melting point 178-216℃ Applicable to aluminum soldering. Prevent galvanic corrosion.