Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond

Solder paste (bottle)

Prevent "Tombstone" phenomenon BT02B878C

Addition of Ag to eutectic alloy widen the melting point
which may prevent “Tombstone” phenomenon.
Enhance adhesive charactoristic of flux may prevent micro component moving after mounting.
Also addition of Ag can prevent Ag corrosion and can get more strong soldering joint.

Alloy type Sn62-Pb36-Ag2
Flux type MIL-RMA
Halide contents(%) 0.04%
Powder particle size(μm) 45~25(Type3)
Flux contents(%) 9.5%
Copper plate corrosion No corrosion
Copper mirror corrosion No corrosion
Insulation resistance(Ω) more than 5.0×108Ω
Electrochemical migration No Migration
Flux name 878