M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Oxidation suppression element redues the formation of oxidized layer.Stabilize product qualiity,reduce the cleaning frequency of the surface improve the workabiity.
Surface of solder bath
Suppresses the oxidation of surface of solder bath and reduce the oxidized layer.
Solder bath temp:450℃
Standing time:10 min
Prevents solder ball spattering by thermal decomposition of polyurethane-ciat because it suppresses the formation of oxidized layer in the solder bath.
●Comparing solder spattering of terminal treatment
Stable terminal treatment with high quality.
Parts:Motor coil
Solder bath temp:450℃
Adaptable for various temperature of solder bath 250～500℃.It can suppress oxidation stably,regardless surface mounted component,solderbath and condition.
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