[Flux cored solder wire] Residue crack preventing type DDL series

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Flux cored solder wire

Residue crack preventing type DDL series

Prevent residue crack

The flexible residues prevent cracking due to thermal shock and vibration. Omitting the step of applying coating material leads cost reduction.

Prevent residue cracking No need coating material

●Thermal shock test

High reliability, no crack, no peeling
after 1000 heat cycle test.
【Condition】　-30℃～110℃ 30min 1000cycles

Joint develpment with DENSO

Full cooperation with Autmotive electrical equipment specialists in specification development and product evaluation.Coexistance at a high level about reliability and workability.

Good wettability

●Wettability test by using soldering robot.

Also capable for high difficulty components such as deep through-hole.
【Condition】
Iron mode:Line soldering
Iron temp:350℃
Iron speed:10mm/s

Capable in various soldering methods

Hand soldering, Iron robot, LASER, etc., Can use in various soldering methods.We can support wide range of diversified components.

Capable for Beam Heating

●Wettability test for connector by using light beam

Capable for rapid heating by light, stable wettability.

【Condition】
Cu Pad,One side
Beam power:40W

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type	JIS-AA
Flux contents (%)	3.0％、4.0％
Halide contents	0.06％～0.10％
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 1.0×10⁹Ω
Electrochemical migration	No migration
Flux name	DDL

Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond