M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
The special activater enables to use low-Ag alloy.Achieves both of halogen-free and cost reduction.
●High temperature preheating test
Low Ag alloy has euivalent wettability to 3Ag
Condition:Atmospheric
Component:QFP
0.5mm pitch
Easily applicable to low Ag for the improved heat resistance of the flux.It may help to reduce the cost.
●Chip side ball test after reflow(3216 chip)
Reduce the chip side ball, ensure the good SMT quality
Selecting proper activator achieved less flux spattering during reflow soldering
●Spattering test with reflow
Stable shape after long time printing
J3-1001-UG(3Ag)
0.4mm pitch QFP
Stencil thickness:0.12mm
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | Halogen free |
| Halide contents | Less than 0.02% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 11.5% |
| Deterioration（Pa・S） | 190 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 900 Br : Less than 900 |
| Flux name | 8850 |
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