M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Solder paste using high melting point alloy.
Suitable for components which has high temperature
such as power semiconductor.
Applying high viscosity flux may prevent solder balls
during reflow process.
| Alloy type | Sn5-Pb92.5-Ag2.5 |
|---|---|
| Flux type | RMA |
| Halide contents（％） | 0.10±0.04％ |
| Powder particle size（μm） | 45~25µm |
| Flux contents（％） | 8.0±0.5、9.5±0.5％ |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 8882 |
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