M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Elasticity of flux residue of applying special resin prevents crack of residue after soldering and helps to improve surface insulation resistance greatly
●Thermal shock test(QFP shoot in transmitted light)
【Conditions】
-40℃ to 80℃ 30min 168 Cycles,
0.5mm pitch QFP
Select suitable activators for synthetic resin and the wettability is almost same as conventional solder paste
●Test by reflow soldering
Atmospheric:N2
Pre heat:150～200℃ 120 seconds
Main heat:240～245℃, 45 seconds
Select suitable base resin and activators in order to get high surface insulation resistance.
●Surface insulation resistance test
Achieve a high insulation resistance value than regular products
【Conditions】
Test board:JIS-II
Voltage:100V
Temp:85C
Humidity:85%
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | JIS-AA |
| Halide contents | Less than 0.02% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 12.0% |
| Deterioration（Pa・S） | 210 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×109Ω |
| Electrochemical migration | No migration |
| Flux name | 1500 |
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