M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Special activator enables rapid heating SMT by LASER
Solution of solder ball by reducing slumps in heat.
●Comparison of solder ball by optical beam
No solder ball by rapid heating
1608R Chip
Beam power:30W
| Alloy type | Sn63-Pb |
|---|---|
| Flux type | JIS-AA、MIL-RMA |
| Halide contents（％） | 0.08% |
| Powder particle size（μm） | 45～25(Type3) |
| Flux contents（％） | 12.0% |
| Copper plate corrosion | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | more than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 3229 |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.
Products