M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.
●Comparison of solder ball
No solder ball by rapid heating
1608R chip
Beam power:40W
No halogen addition including chlorine(Cl) and bromine(Br).Halogen-free compliant with curent all halogen-free standards.
●Compliant situation of 3232 series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non Compliant |
Comply to all of halogen free standards
Special designed for the soldering of micro-components,Solution for peculiar problems of micro-components.
●SMT test of QFP parts
Suitable for various SMT parts
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | 0.10%～0.14% |
| Powder particle size（μm） | 25～15(Type 5) |
| Flux contents（％） | 14.5% |
| Deterioration（Pa・S） | 100 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 3232 |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.
Products